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Sandisk (SNDK) Q1 Fiscal Year 2027 Earnings Call Transcript

Sandisk (NASDAQ: SNDK) kicked off fiscal year 2027 with record first-quarter results, reporting revenue of $11 billion, non-GAAP gross margin of 85.1%, and non-GAAP EPS of $49.51, while returning $5 billion to shareholders through buybacks and announcing an 8-for-1 stock split. In this Q1 FY2027 earnings call transcript, CEO David Goeckeler and CFO Luis Visoso discuss AI-driven NAND demand, KV cache and inference workloads, the BiCS8, BiCS9 and BiCS10 roadmap, the first HBF (high-bandwidth flash) tape-out, NBM customer partnerships, and second-quarter guidance of $12.2 billion to $12.6 billion in revenue.

Operator Introduction

OPERATOR: Good afternoon and welcome to Sandisk’s 1st quarter fiscal year 2027 earnings conference call.

All participants will be in a listen-only mode. Should you need assistance, please signal a conference specialist by pressing the star and then 0 on your telephone keypads.

After today’s presentation, there will be an opportunity to ask questions. To ask a question, you may press star and then 1 on your telephone keypad. To withdraw your questions, you may press star and 2.

Please also note today’s event is being recorded.

At this time, I’d like to turn the floor over to Ivan Donaldson, Vice President of Investor Relations. Please go ahead.

Forward-Looking Statements

Ivan Donaldson, Vice President of Investor Relations – Sandisk: Before we begin, please note that today’s discussion will contain forward-looking statements based on management’s current assumptions and expectations, which are subject to various risks and uncertainties.

These forward-looking statements include expectations for our technology and product portfolio, our business plans and performance, our capital allocation priorities, market trends and opportunities, and our financial results.

We assume no obligation to update these statements.

Please refer to our annual report on Form 10-K and our other filings with the SEC for more information on the risks and uncertainties that could cause actual results to differ materially from expectations.

We will also make references to non-GAAP financial measures today. Reconciliations between the non-GAAP and comparable GAAP financial measures are included in the written materials posted in the Investor Relations section of our website.

With that, I’ll turn the call over to David.

CEO Remarks: Q1 FY2027 Highlights

David Goeckeler, Chairman and Chief Executive Officer – Sandisk: Thanks, Ivan.

Good afternoon, and thank you for joining Sandisk’s fiscal first quarter 2027 earnings call.

We began fiscal year 2027 with another strong quarter. Creating value for customers and shareholders and delivering results above guidance. Our strategy is working and our execution is delivering strong results.

Revenue for the quarter was $11 billion. Non-GAAP gross margin was 85.1%. And non-GAAP earnings per share was $49.51. We generated $5.7 billion of adjusted free cash flow and returned $5 billion to shareholders through share repurchases.

Our confidence in the long-term trajectory of the business is grounded in 3 enduring strengths. Technology leadership, deep customer partnerships, and disciplined financial management.

These strengths are reinforced by a structural increase in NAND demand driven particularly by AI and by customer signals now extending beyond fiscal year 2030 through our new business model, our NBM partnerships.

Together, they position us to invest with confidence in our technology roadmap, strengthen and expand our customer relationships, and deliver growing and durable free cash flow while returning capital to shareholders.

Technology Leadership: BiCS8, BiCS9, BiCS10 and HBF

It starts with our technology leadership.

BiCS8 is the backbone of our current production portfolio in the industry benchmark for performance and density across TLC and QLC. BiCS8 introduced our CMOS directly bonded to array, our CBA architecture. Enabling the performance required by AI data center customers and establishing the framework for future generations.

BiCS9 pairs the proven BiCS8 cell array with next-generation CMOS, significantly increasing interface performance while retaining a mature memory architecture.

BiCS10 advances the full node architecture across both TLC and QLC with a 1 terabit TLC die designed for performance-intensive workloads and a 2 terabit QLC die delivering industry-leading density and twice the read and write bandwidth of BiCS8. Together, these technologies will extend the BiCS8 foundation to meet the evolving performance and capacity requirements of next-generation infrastructure.

Beyond the core roadmap, high-bandwidth flash, or HBF, reached an important milestone in the fiscal first quarter with the tape-out of our first HBF memory die. With fabrication now underway.

As we outlined at Investor Day, HBF is a new memory architecture for inference that targets HBM-class read bandwidth with substantially greater capacity to support larger models, longer context lengths, and growing KV caches.

It is designed to complement HBM by bringing NAND-class capacity closer to the processor, and we remain on track to deliver samples of our first HBF-based products next calendar year.

HBF remains a future innovation and is not included in the long-term financial model we introduced at Investor Day. As customer adoption, product requirements, and manufacturing readiness become more clearly defined, we expect to provide further perspective on the market opportunity.

Customer Partnerships and NBMs

Customers recognize the strength of our innovation and increasingly view Sandisk as an important partner in achieving their growth objectives.

Through our NBMs, we continue to evolve customer relationships into long-term partnerships grounded in innovation, collaboration, and shared commitment.

Our most recent customers’ engagements with the world’s leading AI companies indicate further upside in demand for our technology.

Our market-leading technology, product portfolio, and customer partnerships are the backbone of our strong financial position, which allows us to reinvest to maintain our technology leadership and expand supply through R&D-focused capex.

AI Inference, KV Cache and NAND Demand

Each of these strengths is reinforced by tailwinds from AI. The need for scalable memory and storage is expanding as inference workloads grow, making NAND increasingly integral to AI infrastructure.

During inference, each generated token must reference the context that precedes it, creating a growing KV cache that serves as the model’s working memory.

Longer prompts, more complex reasoning, multimodal inputs, and persistent user context materially increase these storage requirements.

HBM and DRAM support the highest performance tier, while flash provides the capacity required to retain broader context efficiently and avoid costly recomputation.

We believe this is a secular dynamic that is expanding NAND’s role across the AI stack.

The memory hierarchy defines the role of each NAND architecture.

TLC provides the lower latency, higher write performance, and greater endurance required for active datasets, checkpointing, and latency-sensitive KV cache workloads.

In our AI lab comparison we presented at Investor Day, systems utilizing SSD delivered approximately 3 times the token throughput while using approximately 70% 75% less energy than comparable systems relying on volatile memory alone.

QLC further increases storage density for capacity-intensive applications such as data lakes, vector databases that power AI search, and retrieval repositories.

Between these layers, a growing persistent context tier establishes data to be retained and recalled rather than regenerated.

As inference costs decline, we expect the adoption and usage to expand, supporting our view that KV cache will represent approximately 1/3 of the AI data center flash market by the end of the decade.